Tender for Supply and installation of a multi-purpose chip bonding system and advanced material dispenser for the Barcelone Microelectronics Institute funded by the European Union - nextgenerationeu by the recovery and resilience mechanism. scientific project code: (micronanofabs_phase 2)-icts-mrr-2024-04-csic

The tender identified with expedient 34584/26 is related to the sector Supplies.

This tender is located in Bellaterra (Cerdanyola del Valles) BARCELONA, Barcelona, ES, Cataluña, ES.

The tender is classified under several CPV codes, including CPV, among others Microprocessors (No code: 31712116), Electronic integrated circuits and microassemblies (No code: 31712110), among others.